TEMSCON 2019 is the flagship conference of the IEEE Technology and Engineering Management Society (TEMS). This Annual Conference provides studies on concepts, theories, and best practices in the field of technology and engineering management and addresses the methodologies required to move technical ideas to market and where people enable project success.
TEMS focuses on developing leadership skills in the technical industries and associated research and offering you opportunities to develop skills and competencies by collaborating with leading practitioners and scholars where:
TEMS offers conferences, publications, along with many other opportunities to engage. TEMS will continue building programs that allow leaders and researchers to understand and improve the space of technical management.
The theme of this year’s conference is “Leading Innovation in Times of Constant Change,” bridging the space of technology management and practices to the needs of industry and society; coupling management research with industry and society needs.
Join our Technical Activity Committees (TACs) or start one based on your management preferences by contacting any of the TEMS leadership. TACs are open to members and non-members. TAC members help design, run, and build our conferences and publications. TACs also provide the leadership pipeline for the Society, or join any of our Chapters in the local Regions and Sections, or start one yourself.
TEMS offers three publications: LEADER informs you of TEMS activities; The Engineering Management Review (EMR), a “journal of practice;” and the Transactions on Engineering Management, providing forward thinking papers and the latest engineering and technology management research.
Enjoy TEMSCON 2019 and engage in TEMS activities for your benefit as our Society grows to meet its key goal of building technical leadership though understanding of business and management.
For this event I wish to particularly acknowledge the exceptional work of the program co-chairs, Prof. Tugrul Daim and Dr. Jason Hui, the Industry Forum Chair Dr. Andy Chen, the treasurer Dr. Bill Marshall, the publications chair, Mr. Ed Perkins, our exceptional keynote speakers, as well as the technical program committee members and other organizing committee members.
David Bishop
Conference Chairman of TEMSCON 2019,
CEO and Founder of Agile Worx, LLC
Founding chair, Atlanta Chapter, IEEE Technology and Engineering Management Society.
Session Category : Welcome
