Welcome to the IEEE TEMSCON 2019 technical program. We have a great program for technology and engineering management leaders from industry, academia and government representing many different countries.
The theme of this year’s conference is “Leading Innovation in Times of Constant Change.” Advancing technological innovation should not be singled out as technical development only. We also need to think about economic, political and environmental perspectives and their impacts in different settings. Research in technology and engineering management today focuses on identifying the dynamics of these perspectives, which aids us in making more informed decisions.
Emerging technologies such as autonomous driving or blockchain, developments in space travel and artificial intelligence change the way we live our lives or do business. It is critical to understand how this change happens so that we can leverage this development and lead innovation in these times of change.
Presentations in the paper sessions will explore the above themes. These sessions include cutting-edge research in areas like engineering management, technology management, innovation management and project management.
Some of the research focuses on methods such as DevOps, hype cycle and technology mining. Others explore sectors impacted by recent developments including the space program, cybersecurity and automotive. Important trends such as green innovation, big data and blockchain are studied as well.
We thank all the authors and reviewers who made this conference possible.
Your TEMSCON 2019 Program Co-Chairs,
| Tugrul U. Daim, Ph.D. and PICMET Fellow Professor and Director, Technology Management Doctoral Program Dept of Engineering and Technology Management Maseeh College of Engineering and Computer Science Portland State University Editor in Chief, IEEE Transactions on Engineering Management |
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| Jason K. Hui, Ph.D., PMP Senior Staff Project Engineering Manager Elbit Systems of America Associate Editor, IEEE Engineering Management Review |
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Session Category : Welcome
